Basic Cell Architecture For Structured ASICs

ABSTRACT

A basic cell circuit architecture having plurality of cells with fixed transistors configurable for the formation of logic devices and single and dual port memory devices within a structured ASIC is provided. Different configurations of ensuing integrated circuits are achieved by forming variable interconnect layers above the fixed structures. The circuit architecture can achieve interconnection of transistors within a single cell or across multiple cells. The interconnection can be configured to form basic logic gates as well as more complex digital and analog subsystems. In addition, each cell contains a layout of transistors that can be variably coupled to achieve a memory device, such as a SRAM device. By having the capability of forming a logic circuit element, a memory device, or both, the circuit architecture is both memory-centric and logic-centric, and more fully adaptable to modern-day SoCs.

FIELD

The present application is a divisional application of prior pendingU.S. patent application Ser. No. 12/139,974 filed Jun. 16, 2008 which isa divisional application of U.S. patent application Ser. No. 11/189,026filed Jul. 25, 2005 now U.S. Pat. No. 7,404,154 issued Jul. 22, 2008 theentireties of which are incorporated herein by reference. This inventionrelates to integrated circuits and, more particularly, to cell basedintegrated circuit architecture that is configurable for the formationof logic devices and single and dual port memory devices.

INTRODUCTION

An integrated circuit generally includes the interconnection of variouscircuit elements. Those circuit elements include transistors, resistors,capacitors, logic gates, flip-flops, registers, etc. In order to achievefunctionality, the various circuit elements must be interconnected withattention given to where those elements are relative to each other. Inparticular, performance of an integrated circuit is affected by wherethe elements are connected and the interconnect length between elements.As such, optimal performance of circuit elements is generally dictatedby the “layout” of the integrated circuit.

Often, however, a tradeoff between performance and cost exists forlayout considerations. For example, in an application-specificintegrated circuit (ASIC), placement of elements and the interconnectiontherebetween is unique to that particular integrated circuit design.That is, layout is performed on a chip-by-chip basis and cannot beeasily modified whenever a design change is needed for that particularproduct. An ASIC thereby enjoys the benefits of high performance, butalso has a fairly high non-recurring expense each time a design changeis needed.

At the opposite end of the spectrum from ASIC designs is the moreversatile gate array concept. A typical gate array consists ofpre-designed circuit units or cells that are wired together to rapidlyimplement the final integrated circuit customer-specific functionality.The pre-designed circuit elements are called basic cells that, wheninterconnected, becomes the macro cell building blocks for the finalintegrated circuit product. The functionality of the final integratedcircuit is thereby dictated by the interconnection of the macro cells.Gate array technology allows the pre-designed circuit unit to be fixedand need not change from one final circuit design to the next.

In this manner, the design change can be implemented on the variablefabrication layers, yet the fixed layers will remain the same. Placementof interconnection that can vary depending on the intended circuitdesign adds configurability (or reconfigurability) to the gate arraydesign. Thus, the concept of “fixed” and “variable” cell design of gatearray technology offers a lower non-recurring expense if any designchange is needed. Gate array technology generally allows changes to bemade in the field to implement what is known as field-programmable gatearrays (FPGAs). FPGAs unfortunately have lower performance and higherpower consumption relative to ASIC designs.

A special form of ASIC, known as structured or platform ASIC, servessomewhat as a compromise between FPGAs and standard ASICs. Similar togate arrays, structured ASICs implement basic cells that areinterconnected to form circuit elements. However, structured ASICs arenot programmed in the field as in FPGAs, nor do structured ASICs consistof predesigned circuit elements (e.g., logic gates, flip-flops,registers, etc.) that are wired together to form the integrated circuit.Instead, structured ASIC technology utilizes cells having a fixedpattern of transistors that are configurable for forming circuitelements with overlying variable interconnect layers.

While structured ASICs have better performance and lower powerconsumption than gate arrays and have a lower non-recurring expenserelative to standard ASICs, structured ASICs nonetheless havelimitations as to what type of integrated circuit they can form. Inparticular, conventional structured ASICs are generally limited toforming logic circuits, such as NAND gates, NOR gates, etc. However,with the advent of greater integration and the use of system-on-chip(SoC) technology, modern designs mandate that the final integratedcircuit contain more than just logic gates.

It would be desirable to implement a structured ASIC that can bereconfigured as logic gates, registers, flip-flops, and all other logiccircuitry, as well as or in addition to memory. It would also bedesirable to introduce a structured ASIC that can achieve a single portor dual port memory cell occupying a minimal amount of substrate space.

SUMMARY

The problems outlined above may be in large part addressed by a basiccell circuit architecture having plurality of cells with fixedtransistors configurable for the formation of logic devices and singleand dual port memory devices within a structured application specificintegrated circuit. Different configurations of ensuing integratedcircuits are achieved by forming variable interconnect layers above thefixed structures. The circuit architecture can achieve interconnectionof transistors within a single cell or across multiple cells. Theinterconnection can be configured to form basic logic gates as well asmore complex digital and analog subsystems. In addition, each cellcontains a layout of transistors that can be variably coupled to achievea memory device, such as a SRAM device. By having the capability offorming a logic circuit element, a memory device, or both, the circuitarchitecture is both memory-centric and logic-centric, and more fullyadaptable to modern-day SoCs. Moreover, the structured ASIC circuitarchitecture has the benefits of gate array technology with lowernon-recurring expenses, yet benefits from higher performance and lowerpower consumption associated with standard ASIC technology. Thefollowing are mere exemplary embodiments of the circuit architecturedescribed herein and are not to be construed in any way to limit thesubject matter of the claims.

According to one embodiment, the circuit architecture includes aplurality of cells each comprising a first set of NMOS transistors and asecond set of NMOS transistors having comparatively greater widths thanthe first set of NMOS transistors. In addition, a ratio of the averagedrive currents of the second set of NMOS transistors to the averagedrive currents of the first set of transistors is at least approximately6.0.

In another embodiment, the circuit architecture includes a plurality ofcells each having a fixed arrangement of transistors comprising a firstset of NMOS transistors configured to function when coupled to overlyingvariable layers as either pass devices of memory circuitry or tri-statepass gates of some types of logic circuitry depending on the layout ofthe variable overlying layers coupled thereto. In addition, the fixedarrangement of transistors includes a second set of NMOS transistorshaving greater widths than the first set of NMOS transistors and whichare configured to function when coupled to variable overlying layers aseither pull down devices of memory circuitry or logic gates of logiccircuitry depending on the layout of the variable overlying layerscoupled thereto. The fixed arrangement of transistors further includes afirst set of PMOS transistors configured to function when coupled tovariable overlying layers as pull up devices of memory circuitry andalso includes a second set of PMOS transistors configured to functionwhen coupled to variable overlying layers as tri-state pass gates ofsome types of logic circuitry. Moreover, the fixed arrangement ofstructures includes a third set of PMOS transistors comprising greaterwidths than at least the first set of PMOS transistors and configured tofunction when coupled to variable overlying layers as logic gates oflogic circuitry.

In yet another embodiment, the circuit architecture includes anarrangement of transistors comprising a first pair of gate linesspanning above an n-type diffusion region and two distinct p-typediffusion regions, wherein a width of one of the two p-type diffusionregions is smaller than a width of the other of the two p-type diffusionregions. The circuit architecture further includes a second pair of gatelines dividedly arranged in parallel and on opposing sides of the firstpair of gate lines, wherein the second pair of gate lines span aboveportions of the p-type diffusion region with the larger width. Moreover,the circuit architecture includes a set of four gate lines arranged inparallel with the first pair of gate lines. The set of four gate linesspan above extensions of the n-type diffusion region respectivelyarranged near opposing corners of the n-type diffusion region. Theextensions comprise smaller widths than the portion of the n-typediffusion region below the first pair of gate lines.

DRAWINGS

Other objects and advantages of the invention will become apparent uponreading the following detailed description and upon reference to theaccompanying drawings in which:

FIG. 1 a depicts a top view of an exemplary basic cell architecture;

FIG. 1 b depicts a top view of another exemplary basic cellarchitecture;

FIG. 2 depicts a top view of an intermediate fabrication cellarchitecture having a first metal layer formed above the basic cellarchitecture one of FIGS. 1 a and 1 b;

FIG. 3 depicts a top view of an intermediate fabrication cellarchitecture having a second metal layer formed above the intermediatefabrication cell architecture of FIG. 2;

FIG. 4 depicts a top view of a SRAM cell having a third metal layerformed above the intermediate fabrication cell architecture of FIG. 3;

FIG. 5 depicts a circuit schematic diagram of the SRAM cell illustratedin FIG. 4;

FIG. 6 depicts a top view of a flip-flop device formed from fourduplicate basic cell architectures of one of FIGS. 1 a and 1 b; and

FIG. 7 depicts a circuit schematic diagram of the flip-flop deviceillustrated in FIG. 6.

While the invention is susceptible to various modifications andalternative forms, specific embodiments thereof are shown by way ofexample in the drawings and will herein be described in detail. Itshould be understood, however, that the drawings and detaileddescription thereto are not intended to limit the invention to theparticular form disclosed, but on the contrary, the intention is tocover all modifications, equivalents and alternatives falling within thespirit and scope of the present invention as defined by the appendedclaims.

DESCRIPTION

Turning to the drawings, FIG. 1 a illustrates an exemplary plan view ofbasic cell architecture 10 having a plurality of transistors, which mayserve as a repeatable base pattern of fixed layers for a structuredASIC. In particular, basic cell architecture 10 illustrates a layout ofa plurality of transistors dimensionally configured and arranged suchthat when replicated within an array of cells, the plurality of cellsforms a building block for subsequent formation of logic circuitry andmemory circuitry with overlying variable layers. The memory circuitrymay include any memory technology that can receive written logic valuesand transmit read logic values that are stored in the interim, such asSRAM, DRAM or non-volatile technologies. The logic circuitry may includeany logic circuitry, such as but not limited to NAND gates, NOR gates,XOR gates, AOIs, registers, and flip flops.

As noted above, the fixed layers of structured ASIC do not change acrossa wafer and, thus, do not change across each diced integrated circuit.The fixed layers include all processing steps through and including thefirst metal layer. In particular, the formation of basic cellarchitecture 10 may begin with bare substrate or silicon and includeimplant, diffusion, deposition, etch, etc. cycles to form a plurality ofgate lines and contacts extending downward to diffusion regions of thesubstrate as shown in FIG. 1 a and described in more detail below. Thevariable layers are formed later in the fabrication sequence and differdepending on the final integrated circuit configuration.

As shown in FIG. 1 a, basic cell architecture 10 includes six NMOStransistors and six PMOS transistors. In particular, basic cellarchitecture 10 includes NMOS transistors N1-N4 formed from gate lines14 a-14 d and NMOS transistors N5 and N6 formed gate lines 16 a and 16b, all of which are arranged over portions of n-diffusion 12. Inaddition, basic cell architecture 10 includes PMOS transistors P1-P2 andP5-P6 respectively disposed over p-diffusions 22 and 24 and formed fromgate lines 16 a and 16 b. Furthermore, basic cell architecture 10includes gate lines 26 a and 26 b disposed over portions of p-diffusion24 for the respective formation of PMOS transistors P3 and P4.

Although not necessarily so restricted, in some embodiments it may beadvantageous to form gates lines 14 a-14 d, 16 a-16 b, and 26 a-26 b inthe same direction to limit the variation of offsets which may beinduced by the photolithography process. In addition, although basiccell architecture 10 illustrates gate line 14 a in a different layoutconfiguration than gate line 14 c, the cell architecture is not solimited. In particular, gate line 14 a may, in some embodiments, be laidout in the same manner as gate line 14 c. As a result, gate line 14 amay, in some cases, be a minor image of gate lines 14 b rather than aminor image of gate line 14 c as viewed along respective reference linesinterposed between the gate lines.

Alternatively, gate line 14 a may, in some embodiments, be laid out in aconfiguration which is not a mirror image of any one of gate lines 14b-14 d. In yet other cases, one or more of gate lines 14 a-14 d may belaid out in a different configuration than shown in FIG. 1 a, includingthose which may or may not be minor images of the other gates lines.

Power/ground contact to p-diffusions 22 and 24 and n-diffusion 12 may bemade at n-well tap 28 and p-well tap 18 through diffusion regions 30 and20, respectively. Additional contact to p-diffusions 22 and 24 andn-diffusion 12 may be made through contacts 32. Furthermore, basic cellarchitecture 10 may include contacts 34 to gate lines 14 a-14 d, 16 a-16b, and 26 a-26 b.

It is noted that the distinction among the illustration of contactswithin FIG. 1 a is that contacts 32 are shown from diffusion upward andcontacts 34 are shown from gate line upward. The arrangement of contacts32 and 34 are in one embodiment configured with respect to the positionof gate lines 14 a-14 d, 16-16 b, and 26 a-26 b to control parasiticcapacitance, maximize accessibility for the formation of memory or logiccircuitry, and maximize circuitry density. In addition, NMOS transistorsN1-N4 are formed of separate gates lines and are not connected to anyother transistors to minimize word line capacitance of ensuring memorycircuitry.

In general, gate lines 14 a-14 d, 16-16 b, and 26 a-26 b, contactstructures 32 and 34, and well taps 18 and 28 may include any materialknown for such structures in the semiconductor fabrication industry,such as but not limited to polysilicon, aluminum, copper, titanium,tungsten or any alloy of materials.

The periphery of basic cell architecture 10 is outlined in FIG. 1 a todenote the arrangement of components therein. The dotted line, however,is not included within the circuit and, therefore, does not serve afunction for the circuit. As shown in FIG. 1 a, p-well tap 18 and n-welltap 28, diffusion regions 20 and 30, some of contacts 32, and portionsof n-diffusion 12 and p-diffusion 24 may be formed along the peripheryof basic cell architecture 10. Such placement may be indicative that thecomponents are shared with adjacent cells.

For example, each of taps 18 and 28 and diffusion regions 20 and 30 maybe shared by four adjacent cells to allow a single contact to wells offour cells. In addition, n-diffusion 12 and p-diffusion 24 may extendinto cells arranged on opposing sides of basic cell architecture 10 forthe fabrication of transistors therein. Furthermore, some of contacts 32may be shared among adjacent cells. Although such configurations may beadvantageous for reducing the horizontal dimensions of basic cellarchitecture and the overall size of the array of cells, one or more ofsuch components may not be shared among adjacent cells in someembodiments.

In particular, each cell of an array may be formed with its own welltaps, diffusion regions, and contact structures. In general, thehorizontal and vertical dimensions of basic cell architecture 10 are anintegral multiple of the routing grid used to size circuit structures,which is typically equal to the metal pitch offered for the particularlayout technology. Exemplary horizontal and vertical dimensions forbasic cell architecture 10 may be 7 routing grids and 14 routing grids,respectively. However, fewer or more routing grids may be employed.

In general, the width of a transistor, as used herein, may refer to thedimension of the transistor gate line portion extending directly overthe diffusion region of the transistor specifically along the directionwhich the gate line extends over isolation regions bordering thediffusion region. On the contrary, the length of a transistor maygenerally refer to the dimension of the gate line extending betweensource and drain regions disposed within the transistor diffusionregion. Hence, the length of a transistor may also be defined as thedimension of the gate line orthogonal to the transistor width. Theorientations of width and length dimensions of NMOS transistor N2 areillustrated in FIG. 1 a as W and L, respectively, and may be similarlyapplied to the other transistors of the cell architecture.

Although NMOS transistors N1-N6 and PMOS transistor P1-P6, or morespecifically, gate lines 14 a-14 d, 16 a-16 b and 26 a-26 b are shown inFIG. 1 a as having substantially similar lengths, the transistors arenot necessarily so limited. In particular, any one or more of NMOStransistors N1-N6 and PMOS transistor P1-P6 may have a different lengththan the other of the transistors. In some instances, it may bedesirable to fabricate NMOS transistors N1-N4 with a channel lengthlarger than the minimum allowed channel length of the design rules and,thus, may be larger than the channel length of NMOS transistors N5-N6 orPMOS transistors P1-P6. This helps to reduce bit line leakage of memorydevices.

Also, by increasing the channel length of the smaller n-channel device,an improvement in the stability of the cell and a reduction in thevariability of the bit line leakage can be accomplished. This isprimarily due to the reduced variability with which larger channellengths can be fabricated. Analysis can be done to determine how largeto make the channel length in order to reduce bit line leakage on eachbit line, yet not to significantly degrade the access times.

As shown in FIG. 1 a, different sets of NMOS transistors N1-N6 and PMOStransistors P1-P6 include different widths. In particular, basic cellarchitecture 10 includes NMOS transistors N1-N4 having substantiallysmaller widths than NMOS transistors N5 and N6. In addition, PMOStransistors P1 and P2 have smaller widths than PMOS transistors P3 andP4, which in turn have smaller widths than PMOS transistors P5 and P6.As discussed in more detail below, such a variation of widths mayprovide configurability to basic cell architecture 10 for forming eitherlogic devices or memory devices, depending on the layout of subsequentlyformed variable layers.

In some embodiments, it may be advantageous for each of NMOS transistorsN1-N4 to have substantially equal widths and for each of NMOStransistors N5-N6 to have substantially equal widths. In addition, itmay be advantageous for PMOS transistors P1-P2, P3-P4, and P5-P6 withintheir respective sets to have substantially equal widths. Suchconfigurations may insure the operational load incurred by subsequentlyformed logic or memory circuitry is substantially balanced among thesimilar width transistors.

In other embodiments, the widths of the transistors within a respectiveset may not be substantially equal. Rather, the widths of transistorswithin a set may differ with a specific range, while still maintainingthe grander scope of width variations among the different sets oftransistors within basic cell architecture 10. For example, althoughNMOS transistors N1-N4 may not respectively include equal widths in someembodiments, the average widths of the transistors may be relativelysmaller than the average widths of NMOS transistors N5-N6. A similarcomparison may be made for PMOS transistors P1-P6 as well.

In addition to being characterized by width and length dimensions, atransistor may be characterized by the ratio of its width and lengthdimensions (hereinafter denoted as “W/L”), which in combination withthreshold voltage, determines the drive currents or “strength” of thetransistor. In some cases, it may be advantageous for transistors withinthe different sets of NMOS transistors N1-N6 and PMOS transistors P1-P6to have substantially equal strengths to optimize the functionality ofensuing circuitry.

For example, it may be advantageous for each of NMOS transistors N1-N4to have substantially equal strengths and for each of NMOS transistorsN5-N6 to have substantially equal strengths. In addition, it may beadvantageous for PMOS transistors P1-P2, P3-P4, and P5-P6 within theirrespective sets to have substantially equal strengths. Since a given setof transistors are generally configured with same threshold voltage,substantially equal strengths may equate to substantially equal W/Lratios among the transistors of a set. Due to the size variation amongthe sets of transistors, however, the strengths among different set oftransistors may differ.

Exemplary strength ratios among NMOS transistors N1-N6 and PMOStransistors P1-P6 for basic cell architecture 10 are discussed in moredetail below with regard to whether high dopant implants areincorporated into NMOS transistors N1-N4 (high threshold voltage dopantimplant regions are shown and described in reference to FIG. 1 b).

As noted above, the different sets of transistors among NMOS transistorsN1-N6 and PMOS transistors P1-P6 may, in some embodiments, includesubstantially equal widths and, in other embodiments, slightly differentwidths. In conjunction with such embodiments and the desire to havesubstantially equal strengths among the set of transistors, the lengthsof the transistors within the different sets of NMOS transistors N1-N6and PMOS transistors P1-P6 may be same or differ as well. Given thevariance of transistor widths and lengths among different sets oftransistors, a variance of W/L dimensions may exist.

For example, ratios of the average proportion of width versus length ofPMOS transistors P1-P2 to the average proportion of width versus lengthof NMOS transistors N1-N4 may be between approximately 3.0 andapproximately 4.0 in some cases. On the contrary, the ratio of theaverage proportion of width versus length of PMOS transistors P1-P2 tothe average proportion of width versus length of NMOS transistors N1-N4may be approximately 1.0 in some cases. For either of such comparisons,larger or smaller ratios may be employed for transistors of basic cellarchitecture 10.

The variation of strengths and, more specifically, widths among NMOStransistors N1-N6 and PMOS transistor P1-P6 may be particularlyadvantageous for providing configurability to basic cell architecture 10for forming either logic devices or memory devices, depending on thelayout of subsequently formed variable layers. In particular, theformation of relatively smaller transistors within basic cellarchitecture 10 may be advantageous for the formation of memory circuitssince read, write and static noise margins are functions of pull-uptransistor widths and pass device widths, the smaller of which producehigher margins.

More specifically, the read margin of an SRAM cell is a function of thestrength of the pull-down device compared to the pass device and thewrite margin is a function of the strength of the pass device inrelation to the pull-up device. Furthermore, the static noise margin ofan SRAM cell is a function of the ratio of the strength of the pull-downdevice to that of the pass device as well as the threshold voltage ofthe transistors. In addition to such a desirable functionality withsmall width transistors for memory circuitry, the small widthtransistors may advantageously lower the dynamic power of a flip flop,particularly when employed on the inter-cell clock nodes.

Contrary to such a desirable functionality with small width transistors,however, logic gates and registers typically employ transistors ofrelatively larger widths. As such, basic cell architecture 10 may beused to form basic logic elements as well as memory cells.

For instance, NMOS transistors N1-N4 may be configured to function whencoupled to overlying variable layers as either pass devices of memorycircuitry or tri-state pass gates of some types of logic circuitry, suchas flip-flops or standard logic multiplexers, for example. In otherembodiments, NMOS transistors N1-N4 may not be coupled to overlyingvariable layers when basic cell architecture 10 is used for fabricationof logic circuitry and, therefore, may be idle.

In addition, larger width NMOS transistors N5-N6 may be configured tofunction when coupled to variable overlying layers as either pull downdevices of memory circuitry or logic gates of logic circuitry dependingon the layout of the variable overlying layers coupled thereto. PMOStransistors P1-P2 may be configured to function when coupled to variableoverlying layers as pull up devices of memory circuitry or, conversely,may not be coupled to overlying variable layers when basic cellarchitecture 10 is used for fabrication of logic circuitry and,therefore, may be idle.

In embodiments in which NMOS transistors N1-N4 functions as tri-statepass gates for fabrication of a flip-flop or a standard logicmultiplexer, for example, PMOS transistors P3 and P4 may be configuredto function as complementary tri-state pass gates of the flip-flop. Forthe fabrication of other logic circuitry or memory circuitry, however,PMOS transistors P3 and P4 may not be coupled to overlying variablelayers and, therefore, may be idle. Moreover, larger width PMOStransistors P5-P6 may be configured to function when coupled to variableoverlying layers as logic gates of standard logic circuitry. In somecases, larger width PMOS transistors P5-P6, in combination with smallerwidth PMOS transistors P1-P2, may provide additional drive in standardlogic circuitry.

Furthermore, although larger width PMOS transistors P5-P6 may not becoupled to overlying variable layers for the formation of memorycircuitry within basic cell architecture 10, the inclusion of such largetransistors may increase the capacitance of the internal node with thememory circuitry as compared to a circuit not including suchtransistors. Such an increase in capacitance may advantageously preventelectron-hole pairs generated from ion strikes from perturbing drainnode voltages and resultantly flipping the state of the device, reducingthe occurrence of soft errors within the memory cell.

In general, ion strikes can generate electron hole pairs which travelalong the path of a single energetic particle as it passes through thedepletion region of memory cells where reverse biasing is appliedbetween a drain region and well of a transistor. Sources of these ionstrikes include alpha particles from radioactive materials and particlesgenerated by neutrons from cosmic rays. Due to the rearrangement ofcharge carriers following an ion strike, a depletion region can collapseand, in turn, funneling from the depletion region can result fromminority carrier flow through the substrate. As a consequence, the drainnode voltage is perturbed and the state of the memory device may beflipped. High capacitance on the drain node, however, may advantageouslyprevent the collapse of the depletion region and, therefore, theinclusion of PMOS transistors P5-P6 may be particularly beneficial.

As is well known in semiconductor fabrication industry, thresholdvoltage magnitude VT of a transistor generally varies with the width ofthe transistor. In particular, the threshold voltage magnitude VT of atransistor separated by trench isolation structures may decrease as thewidth of the transistor decreases. Such a phenomenon is sometimesreferred to as the inverse narrow width effect. In contrast, thethreshold voltage magnitude of transistors separated by isolationregions fabricated from techniques other than trench isolation processesmay increase as the width of the transistor decreases.

A threshold voltage magnitude lower than its design value is undesirablebecause leakage current is typically increased as threshold voltagemagnitude is decreased. Conversely, high threshold voltage magnitudesmay have an undesirable effect on performance, namely the speed, of thecircuit, particularly at low supply voltages. Therefore, it may bebeneficial to maintain transistor threshold voltage magnitudes of withinpredetermined ranges.

One method of adjusting the threshold voltage magnitude of a transistoris to implant a greater concentration of impurities into the channeldopant region of a transistor such that the channel region comprises ahigher net concentration of electrically active dopants. For example, inembodiments in which basic cell architecture 10 includes trenchisolation structures, additional n-type dopants may be implanted intothe channel regions of NMOS transistors N1-N4 to increase the thresholdvoltage magnitudes of such small-width transistors.

A configuration of basic cell architecture 10 including such highthreshold voltage regions within NMOS transistors N1-N4 is shown in FIG.1 b by the inclusion of regions 36. Regions 36 may advantageously lowerbit line leakage as well as increase read margin of an ensuing memorydevice. In addition, regions 36 may produce higher values of staticnoise margins.

A disadvantage of the inclusion of regions 36, however, is a reductionof cell current within the ensuing SRAM device, such as in theneighborhood of about 15%. This reduction in the cell current is thedirect result of having reduced transistor drive currents (a.k.a.,“strength”) due to the presence of the high-Vt dopant implant. Such acell current reduction may significantly reduce the speed of operationof some logic circuitry and, therefore, high voltage implants are notformed within the channel regions of NMOS transistors N5-N6 and PMOStransistors P5-P6. Rather, NMOS transistors N5-N6 and PMOS transistorsP5-P6 may be formed of standard threshold voltage magnitude.

It is noted that performance of some logic circuitry, such as flip-flopsor standard logic multiplexers for example, is not affected by thereduction of transistor drive current and, therefore, the high voltageimplants within NMOS transistors N1-N4 when they function as tri-statepass devices may not be undesirable. Although not necessarily sorestricted, PMOS transistors P1-P4 may include standard thresholdvoltage magnitudes in some embodiments.

As a result of the higher voltage threshold imparted by regions 36, theratio of drive currents of NMOS transistors N5-N6 to NMOS transistorsN1-N4 (known as the beta ratio for SRAM devices) may be larger than whenregions 36 are omitted from basic cell architecture 10. In particular,the ratio of drive currents of NMOS transistors N5-N6 to NMOStransistors N1-N4 may be between approximately 7.0 and approximately 8.0when regions 36 are included in basic cell architecture 10. In contrast,the ratio of drive currents of NMOS transistors N5-N6 to NMOStransistors N1-N4 may be between approximately 3.0 and approximately7.0, and more specifically, between approximately 6.0 and approximately7.0 when regions 36 are not included in basic cell architecture 10.

Given such strength correlations, the widths of PMOS transistors P1-P2and NMOS transistors N1-N4 may be approximately 200 nm or less, sincesuch dimensions have shown to offer favorable read, write and staticnoise margins. Exemplary margins which may be considered favorable forread and write operations of some memory cells may be greater thanapproximately 20% and 30%, respectively. However, larger or smaller readand write margins may be employed, depending on the memory technologyand design specifications of the device.

In addition, PMOS transistors P5-P6 and NMOS transistors N5 and N6 mayinclude widths as large as possible while generally minimizing the areaoccupied by basic cell architecture 10. PMOS transistors P3-P4 maygenerally, include widths in the range between the widths of PMOStransistors P1-P2 and P5-P6 or equal to either of such widths. In anycase, NMOS transistors N1-N6 and PMOS transistors P1-P6 are in oneembodiment optimally sized to achieve the maximum possible electricalperformance at the highest possible density while minimizing power ofthe ensuing device for both memory circuitry and logic circuitry.

In light of such goals, it is noted that the dimensions of NMOStransistors N1-N6 and PMOS transistors P1-P6 in one embodiment are notconstrained to tight dimension specifications, but rather may generallyobey the looser recommended specifications for Design ofManufacturability reasons. For example, the transistors may besusceptible to dimension variations resulting from rounding andmisalignment in photolithography. Physical design rules such as gateline end-cap and distance of the “L” shaped gate line to diffusion arekept especially broad.

FIG. 2 illustrates intermediate fabrication cell 40 exhibiting anexemplary configuration of a first metal layer formed above basic cellarchitecture 10. The patterned metal layer is shown as cross-hatchedmembers 42. The first layer of metal extends over diffusion upwardcontacts 32, gate line upward contacts 34, and a dielectric layersurrounding such contacts. Contact 32 and 34 are outlined by dottedlines to indicate their arrangement below first metal layer 42. Theoutline of the other components within basic cell architecture 10 hasbeen omitted from the figure to simplify the drawing.

Similar to basic cell architecture 10, the first metal layer 42 may befixed in its geometry from cell-to-cell. The purpose of the fixed layerof first metal interconnect is to extend the conductive area laterallyso as to make contact with possibly a upper-level via and second (orthird) metal layers extending over that via. The second and third metallayers and vias between the first metal layer and the second metallayer, or the vias between the second metal layer and the third metallayer provide routability and, thus, configurability to elements withinthe cell as well as elements between cells to form a logic element or amemory cell.

Although several different first metal layer configurations may beemployed with basic cell architecture 10 and, therefore, the fabricationof logic and memory circuitry is not necessarily limited to the layoutillustrated in FIG. 2, the configuration of first metal layer 42 hasbeen optimized to offer a minimal amount of programmable interconnectand maximize pin-accessibility and, consequently, may be beneficial touse. In particular, first metal layer 42 is interlaced between the nodesof NMOS transistors N1-N6 and PMOS transistors P1-P6 mainly in thevertical direction.

Referring to FIG. 3, intermediate fabrication cell 50 exhibiting anexemplary configuration of a second metal layer formed aboveintermediate fabrication cell 40 is shown. The patterned second metallayer is shown as double cross-hatched members. The second layer ofmetal extends over vias 52 and a dielectric layer surrounding suchcontacts. Vias 52 are outlined by dotted lines to indicate theirarrangement below the second metal layer. The outline of the componentswithin basic cell architecture 10 has been omitted from the figure tosimplify the drawing.

As shown in FIG. 6, the second metal layer includes power supply VDDformed along conductor 54 and ground supply VSS formed along conductor64. In addition, the second metal layer includes bit lines connected tothe NMOS transistors N1-N4 to form an ensuing memory circuit or a logiccircuit which employs tri-state pass devices, such as a flip-flop or astandard logic multiplexer, for example. Bit lines on the second layerof metal rather than the third layer of metal proves advantageous inreducing the bit line capacitance and adding flexibility for use of theupper layer metals, such as metal four and higher, for global routing.

Furthermore, if the bit lines are employed within the third layer ofmetal, the memory area would have to be blocked off for global routingabove the memory block leading to increased congestion for globalrouting. As a consequence, increased chip area would be needed torelieve the routing congestion, in turn increasing the cost of the chip.

When comparing FIGS. 1 a, 2 and 3, bit line BLA connects to the drain ofNMOS transistor N4 and extends across adjacent cells along conductor 60.Complementary bit line BLBA connects to NMOS transistor N3 and extendsalong the conductor 62. Bit line BLB connects to transistor N1 andextends along the second layer of metal through conductor 56, while bitline BLBB connects to transistor N2 and extends along conductor 58. Thebit lines may extend along the second layer of metal from cell-to-celland possibly across the entire array.

Similarly, the power and supply conductors also extend from cell-to-celland possibly along the entire array. The spacing between the true andcomplementary bit lines A and B is sufficient to prevent capacitivecoupling of the differential logic values residing on those bit lines.In particular, BLA is spaced considerably from BLB by interveningconductors as are BLBA and BLBB. Such spacing eliminates cross-talk andcapacitive coupling between bit lines on separate ports.

Thus, if a logic value is written to one port through BLA, the presentlayout prevents disruption of a read on another cell via BLB due tocapacitive coupling. Noting that BLA and BLB are very long and extendacross many memory cells, reduction in capacitive coupling isbeneficial. It is noted that the second metal layer layout ofintermediate fabrication cell 50 is exemplary. Several different secondmetal layer configurations may be employed with basic cell architecture10 and, therefore, the fabrication of logic and memory circuitry is notnecessarily limited to the layout illustrated in FIG. 3.

As shown in FIG. 4, a third layer of metal may be formed aboveintermediate fabrication cell 50, forming SRAM circuit 70. The patternedthird metal layer is shown as cross-hatched members extending over vias72 and a dielectric layer surrounding the contacts. Vias 72 are outlinedby dotted lines to indicate their arrangement below the third metallayer. The outline of the components within basic cell architecture 10and the outline of first metal layer 42 have been omitted from FIG. 4 tosimplify the drawing. As shown in FIG. 4, the third metal layer includesword lines WLA and WLB extending along conductors 74 and 76,respectively.

As with the bit lines and power/ground supply conductors of the secondmetal layer, word lines WLA and WLB may extend along the third layer ofmetal from cell-to-cell and possibly along the entire array. As shown inFIG. 4, word lines WLA and WLB and other conductors of the third metallayer are formed orthogonal to the conductors of the second metal layer.In some embodiments, the conductors of the second metal layer may bespecifically formed along the shorter dimension of integrated circuitcell 70 and the conductors of the third metal layer may be formed alongthe longer dimension as shown in FIG. 4, but the circuit is notnecessarily so limited.

A schematic diagram of SRAM circuit 70 is shown in FIG. 5 and is used toshow the interconnections with the underlying transistors of basic cellarchitecture 10. As denoted in FIG. 5, word line WLA is coupled downwardthrough the second and first layers of metal to the gate conductors ofNMOS transistors N3 and N4. Likewise, word line WLB connects throughvias of the second and first layers of metal to the gate conductors oftransistors N1 and N2. PMOS transistors P1-P2 and NMOS transistors N5-N6are shown coupled to power supply VDD and ground supply VSS to serve aspull-up and pull-down devices, respectively. PMOS transistors P3-P6 arenot depicted in the schematic drawing of FIG. 5 since they are notcoupled to the interconnections of the second and third metal layersand, hence, are idle in the circuit.

The schematic diagram of FIG. 5 denotes SRAM circuit 70 as a dual-portmemory cell. In general, a dual-port memory cell allows two independentdevices (e.g., electronic subsystems such as dual processors) to havesimultaneous read or write access to memory cells within the same row orcolumn. Each port of a dual-port memory cell utilizes a pair ofbidirectional ports referred to as port A and port B. Respective wordlines WLA and WLB are used to access each port. Two pairs of bit linesBLA/BLB and BLBA/BLBB are provided for reading/writing to the nodes ofthe storage elements within the memory cell.

The benefits of dual-port memory is more readily achieved if a layoutcell can be designed that is adaptable to being configured as adual-port memory with minimum real estate consumption as achieved withsingle basic cell architecture 10. It is noted that although basic cellarchitecture 10 is used for the formation of dual port SRAM cells, thearchitecture may be alternatively employed to form a single port SRAMcell. Single-port memory cells are somewhat similar to dual-port memorycells, except that each cell contains one word line and a single pair oftrue and complementary bit lines.

It is noted that the third metal layer layout of SRAM circuit 70exemplary and is not necessarily specific to the schematic diagram shownin FIG. 5. Several different third metal layer configurations may beemployed with basic cell architecture 10 and, therefore, the fabricationof SRAM memory circuitry is not necessarily limited to the layoutillustrated in FIG. 4. Furthermore, although FIGS. 3-5 are describedspecifically in reference to the formation of a SRAM cell, it iscontemplated that basic cell architecture 10 may be used to form anytype of memory cell that can receive written logic values and transmitread logic values that are stored in the interim. Alternative forms ofmemory circuitry include ROM, non-volatile cells, DRAM, etc. In yetother embodiments, basic cell architecture 10 may be used to form logiccircuitry.

An exemplary configuration of overlying variable layers for theformation of a flip-flop device is shown and described in more detailbelow in reference to FIG. 6. An exemplary configuration of a flip-flopformed from four adjoining cells comprising basic cell architecture 10is illustrated in FIG. 6. In particular, FIG. 6 illustrates flip-flopcircuit 80 formed from cells 82-88. First metal layer 90 is presented bysingle cross-hatched members and second metal layer 92 is presented bydouble cross-hatched members. The components of basic cell architecture10 have been omitted to simplify the drawing.

As shown in FIG. 6, the first metal layer may be configured in the samemanner as the layout shown in FIG. 2, emphasizing the point that thefirst metal layer may be used to fabricate logic circuitry or memorycircuitry with basic cell architecture 10. The configuration of secondmetal layer 92, however, differs from FIG. 3 in that a flip-flop may beformed rather than a SRAM cell. It is noted that the layout of secondmetal layer 92 is exemplary. Several different second metal layerconfigurations may be employed for the fabrication of flip-flop devicesor other logic circuitry and, therefore, the fabrication of logiccircuitry is not necessarily limited to the layout illustrated in FIG.6.

The elements along the edge of basic cell architecture 10 and firstmetal layer 90 are shared between adjacent cells and, therefore, cells84 and 88 are rotated relative to the position of basic cellarchitecture 10 and fixed metal layer 90 in cells 82 and 86. Thus, cells82-88 are identical to one another, yet rotated as a reflected image ofeach other. A schematic diagram a flip-flop device having thearchitecture depicted in FIG. 6 is illustrated in FIG. 7 as circuit 94.As shown in FIG. 7, 24 transistors are employed in the circuit and,therefore, all of the NMOS transistors and PMOS transistors from basiccell architecture 10 are employed in each cell. It is noted that circuit94 is not limited to the configuration illustrated in FIG. 6.

It will be appreciated to those skilled in the art having the benefit ofthis disclosure that this invention is believed to provide a structuredASIC circuit architecture having plurality of cells with fixedtransistors configurable for the formation of logic devices and singleand dual port memory devices. Further modifications and alternativeembodiments of various aspects of the invention will be apparent tothose skilled in the art in view of this description. It is intendedthat the following claims be interpreted to embrace all suchmodifications and changes and, accordingly, the specification anddrawings are to be regarded in an illustrative rather than a restrictivesense.

1. A circuit architecture comprising an arrangement of transistorsconfigured for formation of at least one of logic circuitry and memorycircuitry depending upon a layout of variable overlying layers, whereinthe arrangement of transistors comprises: a first pair of gate linesspanning above an n-type diffusion region and two distinct p-typediffusion regions, wherein a width of one of the two p-type diffusionregions is smaller than a width of the other of the two p-type diffusionregions, a second pair of gate lines dividedly arranged in parallel andon opposing sides of the first pair of gate lines, wherein the secondpair of gate lines span above portions of the other p-type diffusionregion, and a set of four gate lines arranged in parallel with the firstpair of gate lines, wherein the set of four gate lines span aboveextensions of the n-type diffusion region respectively arranged nearopposing corners of the n-type diffusion region, wherein the extensionscomprise smaller widths than a portion of the n-type diffusion regionbelow the first pair of gate lines.
 2. The circuit architecture of claim1, wherein the extensions comprise a higher net concentration ofelectrically active dopants than the portion of the n-type diffusionregion below the first pair of gate lines, such that a first set of NMOStransistors fabricated at the extensions have a relatively higherthreshold voltage than a second set of NMOS transistors fabricated atthe portion of the n-type diffusion region below the first pair of gatelines.
 3. The circuit architecture of claim 2, wherein a ratio ofaverage drive currents of the transistors formed from the portions ofthe set of four gate lines above the extensions to average drivecurrents of the transistors formed from the portions of the first pairof gate lines is between about seven and about eight.
 4. The circuitarchitecture of claim 1, wherein the extensions comprise a width lessthan about two hundred nanometers.
 5. The circuit architecture of claim1, wherein the overlying layers comprise: bit lines formed along ahorizontal direction of the circuit architecture, and word lines formedalong a vertical direction of the circuit architecture.